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Failure analysis common equipment and laboratory selection

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Industry news
Source:
2019/01/15 10:57
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[Abstract]:
In general, in the process of development, the production and use of integrated circuits failure is inevitable, as people on the continuous improvement of product quality and reliability requirements,
In general, in the process of development, the production and use of integrated circuits failure is inevitable, as people on the continuous improvement of product quality and reliability requirements, chip failure analysis work also appears more and more important, through the chip failure analysis, can help in the design of the integrated circuit designers find defects, process parameters in the design and operation of mismatch or improper and so on.
Specifically, the significance of failure analysis is shown in the following aspects: failure analysis is a necessary means to determine the failure mechanism of chip. Failure analysis provides necessary information for effective fault diagnosis. Failure analysis provides the necessary feedback information for design engineers to continuously improve or repair the design of the chip to make it more consistent with the design specifications. Failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for verifying test process optimization.
 
Main steps and contents of failure analysis:
1. The chip decap is also opened into a cap. Decap can remove the IC seal adhesive and keep the chip functions intact. The equipment used is ADVANCED pst-2000
 
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2. SEM scanning electron microscopy /EDX component analysis: including material structure analysis/defect observation, conventional microregion analysis of element composition, accurate measurement of component size, etc. Provide service laboratory equipment technology Beijing failure analysis laboratory
 
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3. Probe testing: the IC internal electrical signal can be obtained quickly and conveniently with the microprobe. Laser cutting: the cutting of a line or the upper part of the chip with a microlaser beam. The equipment used is the ADVANCED pw-800
 
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4. EMMI detection: EMMI microscopy is an extremely efficient failure analysis tool, providing a highly sensitive and non-destructive fault location mode, which can detect and locate very weak luminescence (visible and near-infrared light), thus capturing leakage current visible light generated by various component defects or anomalies. The equipment used is the ADVANCED p-100
 
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5. OBIRCH application (test for variation of induced impedance of laser beam) The method of OBIRCH can be used to effectively locate defects in the circuit, such as holes in the line and holes under the through-hole. The high-resistance area at the bottom of the through-hole can also effectively detect short circuit or leakage, which is a strong complement to the luminescence microscopy technology. Provide service laboratory equipment technology Beijing failure analysis laboratory
 
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6. X-ray nondestructive detection: the integrity of all kinds of defects in IC package, such as layer stripping, bursting, hole and line drawing, possible defects in PCB manufacturing process, such as poor alignment or bridge, open circuit, short circuit or abnormal connection, and the integrity of tin balls in the package was detected. Provide service laboratory equipment technology Beijing failure analysis laboratory.
 
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Failure analysis common equipment and laboratory selection

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