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Chip leakage analysis has been misguided for years
When it comes to IC leakage positioning everyone thinks OBRICH is the only one, and even now it's ridiculous to think of OBRICH as the name of a device. Today we will introduce this knowledge to you.
OBRICH was actually just a technology, invented and patented by the Japanese NEC in the early days. It works by applying a voltage to the IC that allows a tiny current to flow through it, while scanning the chip's surface with a laser.
At the same time of laser scanning, the tiny current is monitored. When the laser sweeps to a certain position, the current changes greatly, and the device marks the point, that is, this position is the failure point.
TIVA was invented by americans and NEC at the same time, with the same technology as OBRICH, and is now used by the American semiconductor industry. TIVA works by adding a tiny current to the IC, while scanning the chip's surface with a laser. At the same time of laser scanning, the voltage on both ends of IC is monitored. When the laser sweeps to a certain position, the voltage changes greatly, and the device marks this point, that is, this position is the failure point.
OBRICH monitors current changes with voltage, and TIVA monitors voltage changes with current. In general, the reaction is the change of internal impedance of IC. In a nutshell, a laser scan at a point causes a significant change in impedance, and that position is the point of failure. There is also a technology in Singapore that is similar to VBA (plus voltage to monitor voltage changes). Again, OBRICH, TIVA, VBA are not device names, just a technology. The exact name of the device is the laser induced location system.
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